Thick Film on Ceramic Substrates
Thick film hybrid circuits on Alumina (Al2O3) and Aluminum Nitride (AlN)
ALUMINA
AUREL has long expertise in design and production of different hybrid circuits types on alumina or aluminum nitride substrates, with complex lay-out and through hole metallization. The technology allows a high degree of integration, multilayer structures and laser trim.
FEATURES
- Extended temperature range
- High heat dissipation
- Laser trimming of resistors for high accuracy (< 1%)
ALUMINIUM NITRIDE
AUREL can design and mass produce Thick Film Hybrid Circuits on Aluminium Nitride (AlN) on complex geometry substrates, also provided with laser made metal coated pass-thru holes.
Alumina substrate high thermal and mechanical stability is extremely suitable for chip & wire components.
Using last generation screen printing machines, AUREL can reach a very high integration density (net lines up to 150 µm) providing a very high reliability on the products.
